Key Words:
CPU,Thermal,Pads§,Thermal,Conductive,Silicone,Pad§,Heatsink,Cooling,Thermal,Conductive,Silicone,Pad§,CPU,Heatsink,Cooling,Conductive,Silicone,Pad§,Thermal,Conductivity,Thermal,Pads
Features:
1、High temperature resistance, low temperature, good thermal conductivity. 2、Soft, low viscosity. 3、Can be used for CPU chip heat conduction or LED heat conduction. 4、Good heat conduction, very good malleability. 5、Can be cut to any desired size.
Specification:
Description: 100% Brand New & High Quality. You can cut the pad into different size according to your needs. Free installation,maximum heat conduction and increased cooling. Great for graphic cards,graphic chips,North-south bridge chip, memory chipset, IC. Features: 1. High temperature resistance, low temperature, good thermal conductivity. 2. Soft, low viscosity. 3. Can be used for CPU chip heat conduction or LED heat conduction. 4. Good heat conduction, very good malleability. 5. Can be cut to any desired size. Specifications: Condition: 100% Brand New Material: Silica Gel Color: Blue Size: Approx. 100 * 100 * 3 mm / 3.9 * 3.9 * 0.1 in Thermal Conductivity: 5.0 Density: 2.35 Hardness: 13c - 50c Permittivity: 260±18 Temperature: -40°C - 220°C Fire Resistance: UL94 V0 Tensile Strength:(PSI)≥35 Package Included: 1 x CPU Thermal Pad Notes: 1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding. 2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
Product Image: