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Your Credit, Our Guarantee! Enjoy CJ's Special Service of Ordering First, Pay Later Designed for the Special You.
Offer by Supplier: BY Supply Co
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Description
Buyer Reviews (-)
Merchant Comments (-)
Description
Material
Others
Product Attributes
Ordinary
Package Size
60*50*20(1mm)
Key Words:
For,BGA,Template§Universal,Stencils§Reball,Stencils,Template§Heated,Stencils§Stencils,Template§Tin,Plant,Repair
Package List:
27 Pcs/Set x For BGA Universal Stencils
Features:
1、Made of high quality stainless steel and the thickness of the steel mesh is very good. 2、Can be heated by a hot air blower directly for better performance and high reliability. 3、These templates are not easily deformed when heated, and can be reballing by hot air blower for convenience. 4、The table mold area matches to the area of the for BGA chip, which can reduce the waste of solder balls. 5、For BGA heavy ball general mold direct heating rework general chip repair of desktop laptop, game consoles, etc.
Specification:
Condition: 100% Brand NewItem Type: For BGA Universal StencilsMaterial: Stainless SteelColor: As Pictures ShownQuantity: 27Pcs/SetApplication: For BGA Chips ReballingStencils Size: 0.65mm Spacing 1.0mm0.5mm Spacing 0.8mm0.45mm Spacing 0.78mm0.4mm Spacing 0.78mm0.6mm Spacing 1.0mm0.6mm Spacing 0.9mm 0.6mm Spacing 1.1mm0.76mm Spacing 1.27mm0.55mm Spacing 1.02mm0.5mm 35 x 35 Spacing 0.78 mm0.5mm 40 x 40 Spacing 0.8mm0.76mm 30 x 300.6mm 24 x 240.6mm 27 x 270.3mm Spacing 0.58mm0.35mm Spacing 0.65mm0.35mm Spacing 0.6mm 0.3mm Spacing 0.5mm 0.25mm Spacing 0.5mm0.76mm 34 x 340.76mm 37 x 37 Spacing 1.27mm0.76mm 41 x 41 Spacing 1.27mm 1.0mm Spacing 1.5mm0.6mm 30 x 300.6mm 33 x 330.76mm 33 x 33 Spacing 1.27mm0.6mm 41x41
Product Image:
For,BGA,Template§Universal,Stencils§Reball,Stencils,Template§Heated,Stencils§Stencils,Template§Tin,Plant,Repair
Package List:
27 Pcs/Set x For BGA Universal Stencils
Features:
1、Made of high quality stainless steel and the thickness of the steel mesh is very good. 2、Can be heated by a hot air blower directly for better performance and high reliability. 3、These templates are not easily deformed when heated, and can be reballing by hot air blower for convenience. 4、The table mold area matches to the area of the for BGA chip, which can reduce the waste of solder balls. 5、For BGA heavy ball general mold direct heating rework general chip repair of desktop laptop, game consoles, etc.
Specification:
Condition: 100% Brand NewItem Type: For BGA Universal StencilsMaterial: Stainless SteelColor: As Pictures ShownQuantity: 27Pcs/SetApplication: For BGA Chips ReballingStencils Size: 0.65mm Spacing 1.0mm0.5mm Spacing 0.8mm0.45mm Spacing 0.78mm0.4mm Spacing 0.78mm0.6mm Spacing 1.0mm0.6mm Spacing 0.9mm 0.6mm Spacing 1.1mm0.76mm Spacing 1.27mm0.55mm Spacing 1.02mm0.5mm 35 x 35 Spacing 0.78 mm0.5mm 40 x 40 Spacing 0.8mm0.76mm 30 x 300.6mm 24 x 240.6mm 27 x 270.3mm Spacing 0.58mm0.35mm Spacing 0.65mm0.35mm Spacing 0.6mm 0.3mm Spacing 0.5mm 0.25mm Spacing 0.5mm0.76mm 34 x 340.76mm 37 x 37 Spacing 1.27mm0.76mm 41 x 41 Spacing 1.27mm 1.0mm Spacing 1.5mm0.6mm 30 x 300.6mm 33 x 330.76mm 33 x 33 Spacing 1.27mm0.6mm 41x41
Product Image:
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Merchant Comment (-)
Dropshipping
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27Pcs/Set For BGA Universal Stencils Reballing Reball Rework Net Heated Template Set Tin Plant for Desktop Laptop Repair
SKU: CJGJ1120492a
Free shipping
$7.09
Warehouse
Variant(as picture)
- as picture
QTY:
69g
Inventory: --
Estimated Processing Time:
1-3 days for 80% orders
Estimated Delivery Time:
--
Shipping Fee:
0.00
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