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Your Credit, Our Guarantee! Enjoy CJ's Special Service of Ordering First, Pay Later Designed for the Special You.
Offer by Supplier: BY Supply Co
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Description
Buyer Reviews (-)
Merchant Comments (-)
Description
Material
Others
Product Attributes
Ordinary
Package Size
150*150*60(1mm)
Key Words:
BGA,Reballing,Station§Reballing,Station§BGA,Stencil,Kit§BGA,Reballing,Stencil§BGA,Stencil,Holder§Manual,Tools
Package List:
1 x BGA Reballing Station1 x Hex Wrench
Features:
1、This reballing station adopt high quality aluminum alloy material as structure, light and durable 2、This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating 3、Not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm BGA chip ball planting 4、Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads 5、Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
Specification:
Item Type: BGA Reballing StationProduct Model: HT-90 90x90Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5inApplication Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7inMaterial: Aluminum alloyApplication: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
Product Image:
BGA,Reballing,Station§Reballing,Station§BGA,Stencil,Kit§BGA,Reballing,Stencil§BGA,Stencil,Holder§Manual,Tools
Package List:
1 x BGA Reballing Station1 x Hex Wrench
Features:
1、This reballing station adopt high quality aluminum alloy material as structure, light and durable 2、This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating 3、Not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm BGA chip ball planting 4、Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads 5、Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
Specification:
Item Type: BGA Reballing StationProduct Model: HT-90 90x90Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5inApplication Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7inMaterial: Aluminum alloyApplication: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.
Product Image:
Buyer Review (-)
Merchant Comment (-)
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BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Alloy Rework Kit HT‑90 90x90
SKU: CJSD1120533a
Free shipping
$19.96
Warehouse
Variant(as picture)
- as picture
QTY:
419g
Inventory: --
Estimated Processing Time:
1-3 days for 80% orders
Estimated Delivery Time:
--
Shipping Fee:
0.00
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